| 摘要 |
PROBLEM TO BE SOLVED: To secure an accuracy in arrangement position at packaging, and to increase a strength of a joint, with respect to a temperature cycle applied after packaging. SOLUTION: The semiconductor device comprises an electrode 101 electrically connected to a conductive layer which is to be packaged, a structure 102 which projects above the electrode 101 and is formed into a prescribed pattern by using resin, and the conductive layer 103b which is electrically connected to the electrode 101 and is extended to the structure 102. The structure 102 is formed with a convex or concave portion 106, in correspondence with the concave or convex portion of the conductive layer to be packaged, and the conductive layer 103b electrically connected to the electrode 101 is formed on top of the structure 102 using a fluid material. The structure 102 is also provided with dams 111 and 112 for holding back the flow of the fluid material at prescribed positions. COPYRIGHT: (C)2005,JPO&NCIPI |
