发明名称 Apparatus and method of detecting the electroless deposition endpoint
摘要 An apparatus and a method of controlling an electroless deposition process by directing electromagnetic radiation towards the surface of a substrate and detecting the change in intensity of the electromagnetic radiation at one or more wavelengths reflected off features on the surface of the substrate. In one embodiment the detected end of an electroless deposition process step is measured while the substrate is moved relative to the detection mechanism. In another embodiment multiple detection points are used to monitor the state of the deposition process across the surface of the substrate. In one embodiment the detection mechanism is immersed in the electroless deposition fluid on the substrate. In one embodiment a controller is used to monitor, store, and/or control the electroless deposition process by use of stored process values, comparison of data collected at different times, and various calculated time dependent data.
申请公布号 US2005088647(A1) 申请公布日期 2005.04.28
申请号 US20040944228 申请日期 2004.09.17
申请人 APPLIED MATERIALS, INC. 发明人 SHANMUGASUNDRAM ARULKUMAR;BIRANG MANOOCHER;PANCHAM IAN A.;LOPATIN SERGEY
分类号 C23C18/16;G01B11/06;G01J3/28;G01N21/84;G01N21/95;H01L21/66;(IPC1-7):G01J3/28 主分类号 C23C18/16
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