| 摘要 |
A cooling unit for cooling in particular power semiconductors contains a distributor for guiding liquid across a surface to be cooled. The distributor comprises an inlet manifold ( 8 ) and outlet manifold ( 9 ), whereby the inlet and outlet manifolds are connected through a flow cell, which has a main flow channel ( 50 ). The main channel is formed as a meandering sequence of channel segments ( 61,62,63,64 ). It has been found, that the transfer of heat by the liquid in the main flow channel can be improved by introducing a bypass flow channel ( 71,72,73 ) which allows the flow of liquid from the cell inlet to the cell outlet, wherein the bypass flow channel interconnects the channel segments of the main flow channel. |
