发明名称 Method for fabricating CMOS image sensor protecting low temperature oxide delamination
摘要 A method for fabricating a complementary metal oxide semiconductor image sensor is capable of protecting a low temperature oxide from delaminating a passivation layer. The method includes the steps of: forming a passivation layer on a pad metal; exposing a predetermined part of the pad metal by patterning the passivation layer using a first pad mask; forming an oxide layer on the exposed pad metal and the passivation layer formed around the pad open region; forming a color filter, a planarization layer and a microlens, sequentially; forming a low temperature oxide layer on the above structure to protect the microlens; and opening the pad metal by selectively etching the low temperature oxide layer and the oxide layer formed around the pad open region by a second pad mask.
申请公布号 US2005090035(A1) 申请公布日期 2005.04.28
申请号 US20040971183 申请日期 2004.10.22
申请人 MANGNACHIP SEMICONDUCTOR, LTD. 发明人 KIM EUN-JI
分类号 H01L27/146;H01L21/00;H01L21/44;H01L21/82;H01L23/48;H01L23/52;H01L27/14;H01L29/40;H01L31/00;H01L31/0203;H04N5/335;H04N5/369;H04N5/374;(IPC1-7):H01L21/00;H01L31/020 主分类号 H01L27/146
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