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发明名称
Zerstörungsfreie Methode zur Messung der Dicke eines verbundenen Wafers (bonded wafer)
摘要
申请公布号
DE60203377(D1)
申请公布日期
2005.04.28
申请号
DE20026003377
申请日期
2002.05.28
申请人
ASIA PACIFIC MICROSYSTEM, INC.
发明人
WANG, HUNG-DAR;HUANG, RUEY-SHING;GONG, SHIH-CHIN;TSENG, CHUNG-YANG
分类号
B24B37/04;H01L21/66;(IPC1-7):B24B37/04
主分类号
B24B37/04
代理机构
代理人
主权项
地址
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