| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a sample-analyzing method and a sample-collecting device, which can properly analyze an interior portion of a cut strip and a condition of a cut surface. <P>SOLUTION: The surface of a sample is cut by using a diamond cutting blade 1, and the cut strip C is irradiated with an infra-red light, in such a state that the cut strip C is held on the cutting face 1a of the blade 1, and light passing through the cut strip C and the diamond cutting blade 1 is received by a transmission light detector 32 and analyzed. As a result, the influence due to the light reflected by the surface of the cut strip C is suppressed, and the interior portion of the cut strip C and the condition of the cut surface are properly analyzed. Furthermore, by eliminating the need to separate the cut strip C from the diamond cutting blade 1, the problem of the cut strip C collapsing discretely by a force of tweezers or the like used for holding the cut strip C, whereby the cut strip C can be properly analyzed, even when its thickness is very thin (for example, 1μm) or it is brittle is solved. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
