| 摘要 |
PROBLEM TO BE SOLVED: To increase an yield by forming irregularities for heat dissipation on the surface of a resin package at the same time as resin-sealing the periphery of a circuit assembly in a molding process, without causing molding defects such as voids and poor filling, and without applying unnecessary force to bonding wires of the circuit assembly. SOLUTION: The circuit assembly 1 is such that a semiconductor chip 2 is mounted on a lead frame 1a and the bonding wires 3 are wired. In manufacturing a resin-sealed semiconductor device, the periphery of the circuit assembly is sealed with molding resin 2 by a transfer molding method, and at the same time, the plurality of irregularities for heat dissipation are formed on the surface of the molding resin 2. Molten resin to be injected into a cavity 4c through the gate 4e of a metal mold 4 is injected in a direction in which an irregular surface 4d formed in the cavity of the metal mold in correspondence with the concave and convex portions 3 is extended to carry out molding. The irregular surface 4d is formed in parallel with the loop of the bonding wires of the circuit assembly inserted into the metal mold. COPYRIGHT: (C)2005,JPO&NCIPI
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