| 摘要 |
PROBLEM TO BE SOLVED: To implement an electrical connection device that electrically connects two wafers, can compensate surface roughness on one side or both sides of the wafers to be used in the microelectronics field, can withstand a temperature of 200°C or over, can seal the two wafers, can be easily implemented, and preferably utilizes a technique such as that relating to a microelectronics field, or the like. SOLUTION: The device for connecting a first and a second wafer, 2 and 3, comprises at least a first and a second contact member which are inseparably connected to each facing surface of the first and second wafers 2 and 3 respectively, and each of which is implemented as at least a thin layer. The first contact member has a protrusion area 6, while the second contact member is formed of a beam 7, which is suspended over a recess 8 formed on the second wafer 3. The protrusion area 6 has a width L1 smaller than that of the recess 8 and is formed of a stud or a rib. When the first and second wafers, 2 and 3, are assembled, the protrusion area 6 contacts the beam 7 above the recess 8, pressing the beam 7. Thus, the beam 7 is deformed and flexed by the pressure applied by the protrusion area 6. COPYRIGHT: (C)2005,JPO&NCIPI
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