| 摘要 |
PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus which is easily maintained and enables a uniform film to be deposited on a substrate. SOLUTION: In the apparatus, the bottom part of a film deposition chamber 2 is provided with an evaporation source 9 evaporating a vapor deposition material to be stuck to a substrate 7 moved by a transport apparatus. Sticking prevention boards 22a, 22b, 22c and 22d provided at supporting shafts 21a and 21b are arranged at a position above the evaporation source 9. The supporting shafts 21a and 21b are rotatably supported from the outside of the film deposition chamber 2. In adjusting the vapor deposition distribution, the supporting shafts 21a and 21b are rotated, and the inclination of the sticking prevention board 22 is controlled, by which the adjustment of the film deposition distribution to the substrate 7 is made possible. COPYRIGHT: (C)2005,JPO&NCIPI
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