| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability in the interlayer connection of a circuit forming substrate. SOLUTION: In a material for manufacturing a circuit forming substrate, stiffness in the substrate material 1 after a film 2 is separated is increased. By using the material for manufacture, fixing to a stocker is made by a simple method or a sheet material can be easily separated in lamination by performing handling in the integrated state with the sheet material. The contact of conductive paste 5 to other members after film separation can be prevented, even if the base material 1 is thin or is large. As a result, quality reliability is sharply increased in interlayer electric connection using the conductive paste or the like, and the circuit forming substrate having high density and superior quality can be provided. COPYRIGHT: (C)2005,JPO&NCIPI
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