发明名称 |
BONDING WIRE AND INTEGRATED CIRCUIT DEVICE USING THE SAME |
摘要 |
A bonding wire which has a core material and, formed on the core material, a coating layer comprising a metal having a melting point higher than that of the core material and further has at least one of the following characteristics: 1. the wet contact angle of the molten core material with the coating material is 20 degree or more, 2. the curvature radius of a circular arc, which is formed when the bonding wire is allowed to hang down so that the tip thereof contacts with a horizontal plane and the wire is cut at the point being upper from the tip by 15 cm and the cut wire is allowed to fall on the horizontal plane, is 35 mm or more. 3. 0.2 % offset yield strength is 0.115 to 0.165 mN/mum<2>, and 4. the coating layer has a Vickers hardness of 300 or less. |
申请公布号 |
WO2005038902(A1) |
申请公布日期 |
2005.04.28 |
申请号 |
WO2004JP15448 |
申请日期 |
2004.10.13 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LIMITED;KAIMORI, SHINGO;NONAKA, TSUYOSHI;IOKA, MASANORI |
发明人 |
KAIMORI, SHINGO;NONAKA, TSUYOSHI;IOKA, MASANORI |
分类号 |
B23K20/00;H01L21/60 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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