MOUNTING DEVICE AND MOUNTING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a mounting device which can fix a semiconductor wafer by forming a dicing tape in a step of feeding out a strip-shaped material and bonding the dicing tape onto a ring frame. SOLUTION: A mounting device 10 fixes a semiconductor wafer W to a ring frame RF by bonding the dicing tape thereto under a condition that the ring frame and the semiconductor wafer are located on a table 11. The mounting device 10 comprises a precutting means 13 for providing a half-cut cutout L in a film FL surface of a strip-shaped material A in a step of feeding out the strip material A to form a dicing tape T, and a bonding means 34 for releasing the dicing tape from a base sheet S and bonding the tape onto the ring frame RF. COPYRIGHT: (C)2005,JPO&NCIPI