| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for sticking a protecting tape on a semiconductor wafer by which the generation of particles can be reduced when cutting a protecting tape stuck on the surface of a wafer. SOLUTION: A semiconductor wafer 2 wherein a pattern is formed is placed on a holding member 20, a protecting tape 4 for protecting the pattern is stuck on the surface of the semiconductor wafer 2 as well as the surface of an outer circumferential member 21 provided around the holding member 20, and then the protecting tape 4 is cut along the outer circumference of the semiconductor wafer 2. In such the sticking method for the protecting tape, the holding member 20 and the outer circumferential member 21 are arranged close to each other on a holding table 3 for holding the semiconductor wafer 2, and the outer circumferential member 21 is not made integral with the holding table 3. COPYRIGHT: (C)2005,JPO&NCIPI |
