| 摘要 |
PROBLEM TO BE SOLVED: To provide electrolytic copper foil having a fine crystal structure, high tensile strength and excellent elongation properties, to provide a production method for efficiently obtaining electrolytic copper foil without corroding an electrolyzer by using an electrolytic solution comprising no chloride ions, and to provide a copper-clad laminate used, e.g., for a printed circuit board free from the generation of cracks or the like by using the electrolytic copper foil obtained in this way. SOLUTION: The electrolytic copper foil has a fine crystal structure with a mean crystal grain size of≤1μm. In the method of producing electrolytic copper foil, electrolytic treatment is performed using an sulfuric acid electrolytic bath comprising copper ions, having a concentration of sulfuric acid of 30 to 250 g/l, and also comprising benzotriazole or a benzotriazole derivative in 1 to 80 ppm. COPYRIGHT: (C)2005,JPO&NCIPI
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