发明名称 Programmable interconnect structures
摘要 A programmable interconnect structure for an integrated circuit comprises: a pass-gate fabricated on a substrate layer to electrically connect a first node to a second node; and a configuration circuit including at least one memory element to control said pass-gate fabricated substantially above said substrate layer; and a programmable method to select between isolating said first and second nodes and connecting said first and second nodes. A programmable buffer structure for an integrated circuit comprises: a first and a second terminal; and a programmable pull-up and a programmable pull-down circuit coupled between said first and second terminals; and a configuration circuit including at least one memory element coupled to said pull-up and pull-down circuits; and a programmable method to select between isolating said first terminal from second terminal by deactivating said pull-up and pull-down circuits, and coupling said first terminal to second terminal by activating said pull-up and pull-down circuits. A method of forming a programmable interconnect structure for an integrated circuit comprises: fabricating one or more pass-gates on a substrate layer to electrically connect two points; and selectively fabricating either a memory circuit or a conductive pattern substantially above said pass-gates to control a portion of said pass-gates; and fabricating an interconnect and routing layer substantially above said memory circuits to connect said pass-gates and one of said memory circuits and conductive pattern.
申请公布号 US2005091630(A1) 申请公布日期 2005.04.28
申请号 US20030691013 申请日期 2003.10.23
申请人 MADURAWE RAMINDA U. 发明人 MADURAWE RAMINDA U.
分类号 G06F7/38;G06F17/50;G11C5/00;H03K17/693;H03K19/173;H03K19/177;(IPC1-7):G06F17/50 主分类号 G06F7/38
代理机构 代理人
主权项
地址