| 摘要 |
<P>PROBLEM TO BE SOLVED: To allow efficient heat dissipation from a device without increasing the mounting area of a substrate on which a device is mounted. <P>SOLUTION: Electric contacts 306 and 308 are bonded to the top face 302 of a heat-conducting body 301. An LED 314 placed on the top face 302 is connected to electric contacts 306 and 308 through bonding wires 318 and 320 and sealed with a transparent material 326. Thus, an LED device 300 is formed. The LED device 300 is bonded to a circuit trace formed on the bottom face of a circuit board (not shown) having holes through solder bumps 322 and 324. Light emitted from the LED 314 goes out through a hole in the circuit board, and heat emitted from the LED 314 is dissipated through the body 301. A fin-like shape is given to the bottom face 304 of the body 301, thereby allowing the enhancement of the cooling efficiency of the LED 314. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
