COATING FILM FORMATION METHOD AND COATING FILM FORMATION DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a coating film formation device capable of forming a coating film having in-surface uniform property regarding film thickness when a surface of a substrate is coated with a coating liquid at a so-called picture drawn with a single stroke of the brush, and a coating film formation method.

SOLUTION: First coating liquid lines L1 extending to left/right sides in a first coating step are successively formed on a surface of a wafer W from a front end side of the wafer W and thereafter, a second coating liquid line is formed between the first coating liquid lines L1 adjacent to each other in a second coating step from a rear end side or a front end side of the wafer W. Thereby, the coating liquid coated in the first coating step and the coating liquid coated in the second step are mixed, difference of dried degree of the coated coating liquid becomes small in the surface and film thickness of the coating film can be made uniform.

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