METHOD FOR SELECTIVELY COVERING A MICRO MACHINED SURFACE

摘要

On a die that has etchings (12) on a surface, firstly a sheet of negative photoresist (33) is laid down which, by means of an exposure and subsequent development, is left only above the etchings; then, upon the negative photoresist, a positive photoresist (15) is applied, which is subjected to exposure and development to produce functional geometries deposited in thin film; subsequently the positive photoresist is removed in a "lift-off" operation, and the negative photoresist is taken off in a plasma operation, thus revealing the etchings.