发明名称 DEVICE AND ITS MANUFACTURING METHOD, AND ELECTROOPTICAL DEVICE
摘要 PROBLEM TO BE SOLVED: To stably join substrates together and to contribute to improvement of joining strength. SOLUTION: A 1st substrate 2 and a 2nd substrate are electrically joined together. A manufacturing method includes the stages of: forming a recessed part 10 in the 1st substrate 2; mounting a holding member 22 which has an opening 23 corresponding to the recessed part 10 on the 1st substrate 2; coating the recessed part 10 through the opening 23 with a joining material 4 containing conductive particles 4b of particle size smaller than the total of the depth of the recessed part 10 and the thickness of the holding member 22, and removing the holding member 22. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005114915(A) 申请公布日期 2005.04.28
申请号 JP20030347128 申请日期 2003.10.06
申请人 SEIKO EPSON CORP 发明人 SAITO HIDETAKA
分类号 H05B33/04;G09F9/00;G09F9/30;H01L51/50;H05B33/10;H05B33/14;(IPC1-7):G09F9/30 主分类号 H05B33/04
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