发明名称 Method for fabricating a component having an electrical contact region, and component having an electrical contact region
摘要 A method for fabricating a component having an electrical contact region on an n-conducting AlGaInP-based or AlGaInAs-based outer layer of an epitaxially grown semiconductor layer sequence, in which electrical contact material, which includes Au and at least one dopant, is applied and the outer layer is then annealed. The dopant contains at least one element selected from the group consisting of Ge, Si, Sn and Te. Also, a component is disclosed which includes an epitaxially grown semiconductor layer sequence with an active zone which emits electromagnetic radiation, the semiconductor layer sequence having an n-conducting AlGaInP-based or AlGaInAs-based outer layer, to which an electrical contact region is applied using the method described.
申请公布号 US2005090031(A1) 申请公布日期 2005.04.28
申请号 US20040770693 申请日期 2004.02.02
申请人 OSRAM OPTO SEMICONDUCTORS GMBH 发明人 ILLEK STEFAN;STAUSS PETER;PLOESSL ANDREAS;DIEPOLD GUDRUN;PIETZONKA INES;STEIN WILHELM;WIRTH RALPH;WEGLEITER WALTER
分类号 H01S5/042;H01L33/00;H01L33/30;H01L33/40;(IPC1-7):H01L21/00;H01L29/24;H01L21/28;H01L21/320;H01L29/20;H01L31/030 主分类号 H01S5/042
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