发明名称 |
Process for removing impurities from low dielectric constant films disposed on semiconductor devices |
摘要 |
A process of removing impurities from a cured low dielectric constant organic polymeric film disposed on a semiconductor device. The process involves disposing a low dielectric constant curable organic polymeric film on an electrically conductive surface of a semiconductor device. The organic polymeric film is cured on the semiconductor device and thereupon contacted with supercritical carbon dioxide, optionally in the presence of at least one cosolvent.
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申请公布号 |
US2005087490(A1) |
申请公布日期 |
2005.04.28 |
申请号 |
US20030695374 |
申请日期 |
2003.10.28 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CHACE MARK S.;HEDRICK JEFFREY C.;HICHRI HABIB;POPE KEITH R.;LEE JIA;MALONE KELLY;MCCULLOUGH KENNETH J.;MOREAU WAYNE;RESTAINO DARRYL D.;SIDDIQUI SHAHAB |
分类号 |
B01D11/04;(IPC1-7):B01D11/00 |
主分类号 |
B01D11/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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