发明名称 |
Method of dressing polishing pad and polishing apparatus |
摘要 |
A method to quantitatively detect an optimum endpoint of dressing of a polishing pad with a non-destructive monitoring of a surface of the polishing pad is offered. The polishing pad is dressed for a predetermined period, and roughness of the surface of the polishing pad is measured with an optical measurement device made of a laser focus displacement meter. Then a characteristic curve representing a correlation between surface roughness of the polishing pad and dressing time is obtained. A gradient of the surface roughness versus dressing time characteristic curve is obtained. Dressing is stopped when the gradient reaches a predetermined value of gradient. These steps are repeated until the gradient of the surface roughness versus dressing time characteristic curve reaches the predetermined value of gradient. |
申请公布号 |
US2005090185(A1) |
申请公布日期 |
2005.04.28 |
申请号 |
US20040941083 |
申请日期 |
2004.09.15 |
申请人 |
ROHM CO., LTD. |
发明人 |
FUJISHIMA TATSUYA;SAMESHIMA KATSUMI |
分类号 |
B24B53/00;B24B37/00;B24B37/04;B24B49/12;B24B53/007;B24B53/017;B24B53/02;H01L21/304;(IPC1-7):B24B49/00 |
主分类号 |
B24B53/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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