electroplating bath for copper-nickel alloy and method for manufacturing thin film using said electroplating bath,申请号KR20020005275-传众专利搜索

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发明名称	electroplating bath for copper-nickel alloy and method for manufacturing thin film using said electroplating bath
摘要
申请公布号	KR100485808(B1)	申请公布日期	2005.04.28
申请号	KR20020005275	申请日期	2002.01.30
申请人		发明人
分类号	C25D3/12;(IPC1-7):C25D3/12	主分类号	C25D3/12
代理机构		代理人
主权项
地址

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