SLURRY FOR CUTTING SILICON INGOT AND METHOD FOR CUTTING SILICON INGOT THEREWITH

摘要

PROBLEM TO BE SOLVED: To provide a slurry which is used for cutting silicon ingots and can reduce cutting resistance on the cutting of the silicon ingots to efficiently obtain wafers having high qualities, and to provide a method for cutting a silicon ingot therewith. SOLUTION: This slurry which is used for cutting the silicon ingots and contains abrasive grains is characterized by furthermore containing nitric acid and hydrofluoric acid in a mass ratio of the nitric acid to the hydrofluoric acid of 0.5 to 25 : 1. The slurry may further contain acetic acid. The slurry is preferably used at 40 to 110°C. COPYRIGHT: (C)2005,JPO&NCIPI