发明名称 |
RUTHENIUM TARGET FOR SPUTTERING, AND METHOD OF PRODUCING RUTHENIUM TARGET FOR SPUTTERING |
摘要 |
PROBLEM TO BE SOLVED: To provide a ruthenium target for sputtering capable of producing a uniform thin film, and to provide a method of producing the target. SOLUTION: The ruthenium target for sputtering composed of ruthenium or a ruthenium alloy has a columnar crystal structure by an electrodeposition method. The (002) crystal orientation content in the sputtered face measured by an X-ray diffraction method is 70 to 100%. For improving the orientation properties of the (002) plane in this way, the electrodeposited ruthenium or a ruthenium alloy is heated at 1,000 to 1,500°C. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005113174(A) |
申请公布日期 |
2005.04.28 |
申请号 |
JP20030345663 |
申请日期 |
2003.10.03 |
申请人 |
TANAKA KIKINZOKU KOGYO KK |
发明人 |
HARA NORIAKI;SHODA TOSHIAKI;MATSUZAKA RITSUYA;TAKAHASHI TERUYA;SUZUKI HIROAKI |
分类号 |
C23C14/34;H01L21/285;(IPC1-7):C23C14/34 |
主分类号 |
C23C14/34 |
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