发明名称 RUTHENIUM TARGET FOR SPUTTERING, AND METHOD OF PRODUCING RUTHENIUM TARGET FOR SPUTTERING
摘要 PROBLEM TO BE SOLVED: To provide a ruthenium target for sputtering capable of producing a uniform thin film, and to provide a method of producing the target. SOLUTION: The ruthenium target for sputtering composed of ruthenium or a ruthenium alloy has a columnar crystal structure by an electrodeposition method. The (002) crystal orientation content in the sputtered face measured by an X-ray diffraction method is 70 to 100%. For improving the orientation properties of the (002) plane in this way, the electrodeposited ruthenium or a ruthenium alloy is heated at 1,000 to 1,500°C. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005113174(A) 申请公布日期 2005.04.28
申请号 JP20030345663 申请日期 2003.10.03
申请人 TANAKA KIKINZOKU KOGYO KK 发明人 HARA NORIAKI;SHODA TOSHIAKI;MATSUZAKA RITSUYA;TAKAHASHI TERUYA;SUZUKI HIROAKI
分类号 C23C14/34;H01L21/285;(IPC1-7):C23C14/34 主分类号 C23C14/34
代理机构 代理人
主权项
地址