| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroplating device performing continuous treatment where, at the time of via filling, the time for the via filling is reduced, and plating precipitated on the cathode power supply part in a plating liquid bath can continuously be peeled. SOLUTION: In the reel to reel continuous electroplating device where the blind via hole of a flexible multilayer circuit board is filled with plating metal so as to be formed, a cathode power supply part is provided in an electroplating liquid, the cathode power supply part is a belt body having conductivity, a plating peeling treatment tank is provided adjacently to the electroplating tank, and the belt body having conductivity is continuously passed through the inside of the electroplating tank and the inside of the plating peeling treatment tank. COPYRIGHT: (C)2005,JPO&NCIPI
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