发明名称 |
Multilayer electronic substrate, and the method of manufacturing multilayer electronic substrate |
摘要 |
A multilayer electronic substrate is manufactured by employed: a first conductor layer arranged on an insulating substrate; an insulator arranged on the first conductor layer; a resistor arranged on the insulator; and second conductor layers for sandwiching the resistor to be connected to this resistor. In this multilayer electronic substrate, the resistor is trimmed so as to adjust an electric characteristic of a circuit, and a portion of the first conductor layer, which corresponds to a trimming portion of the resistor, is constituted by a first insulating region.
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申请公布号 |
US2005087841(A1) |
申请公布日期 |
2005.04.28 |
申请号 |
US20030684812 |
申请日期 |
2003.10.15 |
申请人 |
ISHIZAKI KOKI;SHIRATO TAKESHI |
发明人 |
ISHIZAKI KOKI;SHIRATO TAKESHI |
分类号 |
H01C17/242;H05K1/09;H05K1/16;H05K3/28;H05K3/46;(IPC1-7):H01L29/00 |
主分类号 |
H01C17/242 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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