发明名称 Multilayer electronic substrate, and the method of manufacturing multilayer electronic substrate
摘要 A multilayer electronic substrate is manufactured by employed: a first conductor layer arranged on an insulating substrate; an insulator arranged on the first conductor layer; a resistor arranged on the insulator; and second conductor layers for sandwiching the resistor to be connected to this resistor. In this multilayer electronic substrate, the resistor is trimmed so as to adjust an electric characteristic of a circuit, and a portion of the first conductor layer, which corresponds to a trimming portion of the resistor, is constituted by a first insulating region.
申请公布号 US2005087841(A1) 申请公布日期 2005.04.28
申请号 US20030684812 申请日期 2003.10.15
申请人 ISHIZAKI KOKI;SHIRATO TAKESHI 发明人 ISHIZAKI KOKI;SHIRATO TAKESHI
分类号 H01C17/242;H05K1/09;H05K1/16;H05K3/28;H05K3/46;(IPC1-7):H01L29/00 主分类号 H01C17/242
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