Stacked multi-component integrated circuit microprocessor

摘要

An apparatus and method for fabricating a microprocessor comprising a first chip ( 12 ) having an active face ( 30 ) including a central processing unit and a second chip ( 14 ) having an active face ( 32 ) electrically connected to the active face of the first chip ( 12 ), wherein the second chip ( 14 ) provides added functionality to the central processing unit of the first chip ( 12 ) and wherein the electrical connections ( 16, 18 ) are through bonding layers ( 28 ) that are in contact with the metalization 26 on the first and second chips ( 12, 14 ), is disclosed.