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发明名称
CHIP SEPARATING METHOD AND JIG USED THEREIN
摘要
申请公布号
KR20050038197(A)
申请公布日期
2005.04.27
申请号
KR20030073431
申请日期
2003.10.21
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
HO, HYEON WOOK
分类号
H01M4/30
主分类号
H01M4/30
代理机构
代理人
主权项
地址
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