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发明名称
RESIN SOLUTIONS CONTAINING RESOL, CURED RESIN LAYERS FORMED USING THE SAME AND METHODS OF FORMING CURED RESIN LAYERS USING THE SAME
摘要
申请公布号
KR20050038273(A)
申请公布日期
2005.04.27
申请号
KR20030073526
申请日期
2003.10.21
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
KIM, JAE HYUN;KIM, MYUNG SUN;KIM, WON MI;KIM, YOUNG HOON;LEE, CHANG HO;MOON, SANG SIK;PARK, SEOK BONG
分类号
C08K3/00;C08L61/06;G03F7/11;(IPC1-7):G03F7/11
主分类号
C08K3/00
代理机构
代理人
主权项
地址
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