Process for roughening surface of wafer,申请号AU20030271172-传众专利搜索

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发明名称	Process for roughening surface of wafer
摘要
申请公布号	AU2003271172(A1)	申请公布日期	2005.04.27
申请号	AU20030271172	申请日期	2003.10.10
申请人	MIMASU SEMICONDUCTOR INDUSTRY CO., LTD.	发明人	MASATO TSUCHIYA;SYUNICHI OGASAWARA
分类号	H01L21/306;(IPC1-7):H01L21/306	主分类号	H01L21/306
代理机构		代理人
主权项
地址

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