| 摘要 |
A base plate 22 of a heat sink or exchanger has carrier fins or plates 13,14,15 with cooling elements K1-K5 comprising a substrate (1, fig 1) with a series of webs (12, fig 1) projecting from an upper side and regularly arranged channels (4, fig 1) extending through the substrate. Fluid flow 10 tangential to the substrate and transverse to the webs is produced by an air blower. The height of the webs is less than the distance between adjacent webs. The plates 13,14,15,22 may all be integrally formed from aluminium as one part, or have an intervening copper plate 16. A copper plate 17 may also be between base plate 22 and the object 11 to be cooled (such as a microprocessor or chip). Gaps between carrier plates may be closed by a wall (23, fig 4), and the webs may be inclined to deflect flow (fig 4). |
