| 摘要 |
1,051,562. Silicon. INTERNATIONAL RECTIFIER CORPORATION. Nov. 23, 1964 [Nov. 26, 1963], No. 47620/64. Heading C1A. A layer of silicon is epitaxially formed on a silicon substrate of one of the conductivity types by diffusing carriers defining the other conductivity type into the surface of the substrate and thereafter epitaxially depositing silicon on the substrate by directing a mixture of a silicon halide gas and a reducing gas against the surface of the substrate and reacting the gases by heating. Diborane may be used as a P-type doping agent, phosphene as an N-type. The silicon may be deposited by reaction of a silicon halide gas, e.g. trichlorosilane, tetrachlorosilane with hydrogen, and doping agents may be introduced with the reacting gases during the growth process. Silicon wafers 20, 21, 22, 23 of P-type conductivity are laid on top of graphite strip heater 13 which may be treated to prevent the wafers sticking thereto. Quartz chamber 10 is purged with hydrogen from source 33 whilst the chamber is heated to 1200‹ C. by heater 13. Phosphene is caused to flow from source 32 through chamber 10 whereupon phosphorus is deposited on the wafers and diffuses into their surfaces to convert their respective surfaces to N-type conductivity. Silicon trichlorosilane from source 34 and hydrogen from source 33 is introduced into chamber 10 with the upper surfaces of the wafers at 1200‹ C. whereupon an N-type epitaxial layer of silicon is deposited. |
