发明名称 Heat sinks
摘要 <p>A heat sink (100) includes a cooling block (105) having a plurality of fins (110) extending through the block to provide a series of coolant channels (112) extending between the fins, the channels having in the interior of the block a venturi narrowing. Beneficially, the channels have coolant entry regions in at least two different regions (115, 120) of the block to direct a plurality of coolant flows into the interior of the block from different directions. <??>Also described is a method of cooling a device such as a processor of a mobile computer used in a vehicle by placing the heat sink or more than one of the heat sinks adjacent to the device to be cooled, preferably with a region in which the venturi narrowing of the coolant channels is provided close to the hottest part of the device to be cooled. <IMAGE></p>
申请公布号 EP1526570(A2) 申请公布日期 2005.04.27
申请号 EP20040104776 申请日期 2004.09.29
申请人 MOTOROLA, INC. 发明人 BARMOAV, FELIX;ALON, YAIR;SLOTIN, HAIM
分类号 H01L23/467;(IPC1-7):H01L23/467 主分类号 H01L23/467
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