Inverter device and method of manufacturing the device thereof, and electric automobile incorporating the inverter device thereof

摘要

By providing a plurality of semiconductor chips (171, 181) that are connected in parallel and constitute one arm of an inverter; a first conductor (25) to which a face on one side of said plurality of semiconductor chips is connected; a wide conductor (33) to which a face on the other side of said plurality of semiconductor chips is connected; a second conductor (27) connected to said wide conductor; and a cooler (22) to which said first conductor (25) and second conductor (27) are connected through an insulating resin sheet (23), part of the heat loss generated in the semiconductor chips is thermally conducted to the first conductor and is thence thermally conducted to the cooler, producing cooling, while another part thereof is thermally conducted to the wide conductor and thence to the second conductor, whence it is thermally conducted to the cooler, producing cooling.