发明名称 |
Semiconductor device having a step-like section on the back side of the substrate, and method for manufacturing the same |
摘要 |
A semiconductor device includes a semiconductor substrate having a first main surface having circuit elements formed thereon, a second main surface substantially opposite to the first main surface, and a plurality of side faces provided between the first main surface and the second main surface. The semiconductor device also includes a plurality of external terminals formed over the first main surface and respectively electrically connected to the circuit elements. The second main surface has a first steplike section which extends from a first side face of the plurality of side faces to a second side face opposite to the first side face.
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申请公布号 |
US6885109(B2) |
申请公布日期 |
2005.04.26 |
申请号 |
US20030621561 |
申请日期 |
2003.07.18 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
YAMAGUCHI TADASHI |
分类号 |
H01L23/52;G01N33/573;H01L21/301;H01L21/3205;H01L23/12;H01L23/31;H01L23/544;H01L29/06;H05K3/30;(IPC1-7):H01L23/28 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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