摘要 |
A circuit module includes an insulating base including a first wiring pattern and a cavity; at least one first electrical component disposed in the cavity; and a lid including a second wiring pattern. The insulating base includes a circuit board composed of laminated substrates and a sidewall protruding from the board surface of the circuit board and forming the cavity together with the circuit board, and the lid has at least one second electrical component fixed thereto. Also, in a state in which the second electrical component is located in the cavity, the lid is fixed on the upper surface of the sidewall so as to cover the cavity, and the first and second wiring patterns are connected to each other with at least one connecting conductor.
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