发明名称 Electric-circuit fabricating system and method, and electric-circuit fabricating program
摘要 An electric-circuit fabricating system for fabricating an electric circuit, by performing a working operation on a circuit substrate, including a substrate holding device to hold the substrate, an imaging device to image a surface of the substrate on which the working operation is to be performed, an imaging control device to control the imaging device to take an image of a substrate-position fiducial mark provided on the substrate, and obtaining substrate-position information on the basis of the image, and a working device to perform the working operation on the substrate, on the basis of the substrate-position information, and wherein the imaging control device is operable to control the imaging device to take an image of a substrate ID mark provided on the substrate as held by the substrate holding device, for obtaining substrate identifying information identifying the substrate, on the basis of the image of the substrate ID mark. Also disclosed are a method and a control program for fabricating an electric circuit by performing the working operation on the substrate.
申请公布号 US6885905(B2) 申请公布日期 2005.04.26
申请号 US20020245365 申请日期 2002.09.18
申请人 FUJI MACHINE MFG. CO., LTD. 发明人 KODAMA SEIGO;KAWAI TAKAYOSHI;MITSUI KAZUO
分类号 H05K13/04;H01L21/00;H05K1/02;H05K3/00;(IPC1-7):H05K13/08;G06F19/00 主分类号 H05K13/04
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