发明名称 |
Fremgangsmåde og anlæg til at danne en coating på et substrat |
摘要 |
In forming a coating of an element, especially a metal, on a substrate moving through an evaporation chamber, the novelty is that (a) the chamber is equipped with a target which has a substrate-facing surface layer containing the element; (b) the coating is formed by vapour deposition and simultaneous cathodic sputtering of the element from the target; and (c) the ratio of the amounts of evaporated and sputtered element is regulated by the energy supply to the target. Also claimed is a coating apparatus especially for carrying out the above process, the apparatus having (i) a chamber (3) equipped with a target (4) having a surface layer (5) facing the substrate (1) and containing one or more of the elements of the coating (2); (ii) a transport system for moving the substrate (1) preferably continuously past the target (4); (iii) a heat regulating system (9) for holding the surface layer (5) optionally in the liquid state and for controlled evaporation of the element; and (iv) a system (6, 8, 10, 11) for cathodic sputtering of the element from the target (4) towards the substrate (1). |
申请公布号 |
DK0780486(T3) |
申请公布日期 |
2005.04.25 |
申请号 |
DK19960203211T |
申请日期 |
1996.11.19 |
申请人 |
RECHERCHE ET DEVELOPPEMENT DU GROUPE COCKERILL SAMBRE, EN ABREGE: RD-CS |
发明人 |
VANDEN BRANDE, PIERRE;LUCAS, STEPHANE;WEYMEERSCH, ALAIN |
分类号 |
C23C14/22;C23C14/34;C23C14/56;(IPC1-7):C23C14/34 |
主分类号 |
C23C14/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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