发明名称 Fremgangsmåde og anlæg til at danne en coating på et substrat
摘要 In forming a coating of an element, especially a metal, on a substrate moving through an evaporation chamber, the novelty is that (a) the chamber is equipped with a target which has a substrate-facing surface layer containing the element; (b) the coating is formed by vapour deposition and simultaneous cathodic sputtering of the element from the target; and (c) the ratio of the amounts of evaporated and sputtered element is regulated by the energy supply to the target. Also claimed is a coating apparatus especially for carrying out the above process, the apparatus having (i) a chamber (3) equipped with a target (4) having a surface layer (5) facing the substrate (1) and containing one or more of the elements of the coating (2); (ii) a transport system for moving the substrate (1) preferably continuously past the target (4); (iii) a heat regulating system (9) for holding the surface layer (5) optionally in the liquid state and for controlled evaporation of the element; and (iv) a system (6, 8, 10, 11) for cathodic sputtering of the element from the target (4) towards the substrate (1).
申请公布号 DK0780486(T3) 申请公布日期 2005.04.25
申请号 DK19960203211T 申请日期 1996.11.19
申请人 RECHERCHE ET DEVELOPPEMENT DU GROUPE COCKERILL SAMBRE, EN ABREGE: RD-CS 发明人 VANDEN BRANDE, PIERRE;LUCAS, STEPHANE;WEYMEERSCH, ALAIN
分类号 C23C14/22;C23C14/34;C23C14/56;(IPC1-7):C23C14/34 主分类号 C23C14/22
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