| 摘要 |
<p>A carrier head that includes a metal plate (402) having an opening (406) formed in a central location. The metal plate has a wafer side, which faces the backside of a wafer (502) during a CMP operation, and a non-wafer side. Positioned above the non- wafer side of the plate, and above the opening in the plate, is a bladder (408) or membrane (702). An inflating pressure is applied to the bladder, or membrane, that is substantially equal to a polishing pressure. To facilitate transporting the wafer, a vacuum can be applied to the opening to adhere the wafer to the carrier head (400). To release the wafer, the bladder, or membrane, can be inflated such that it protrudes through the opening.</p> |
