Manufacture of printed circuit board with test points.

摘要

A plurality of test points are formed on lengthwise and/or widthwise side portions of the substrate of a printed circuit board. Each test point can be formed by cutting away a semicircular part from the side portion of the substrate. Conductive leads are formed on the substrate so as to originate from a component mounting area (on which an IC will be mounted) and reach each of the test points. The test points and the conductive leads are electrically connected together by a plating process. The printed circuit board having test points formed on the side portions thereof causes various limitations and constraints on the placement and arrangement of the test points to be eased and relaxed.