| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component package and its manufacturing method for realizing a shield effect sufficient for miniaturizing an electronic apparatus, reducing its height, reducing its weight and increasing frequency, according to the improvement in the sealing properties of the electronic component package. <P>SOLUTION: The electronic component package is composed of a circuit board 1 having a ground pattern 3, a packaging component 5 composed of an electronic component packaged on an upper surface of the circuit board 1, a seal 6 composed of epoxy resin containing an inorganic filler for sealing the packaging component 5, and a shielding layer, composed of an electroless copper plating layer as a first layer 7 to be formed on the surface of the seal 6, an electrolytic copper plating layer as a second layer 8 and a coating layer for preventing copper oxidation as a third layer 9, and is configured by grounding the shield layer on the ground pattern 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
