| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser beam dicing device that is improved in applicability, such that the device can cope with various processes, such as the formation of a multilayered reformed layer in a wafer, a cutting-accelerating process for a formed reformed layer, and so on. <P>SOLUTION: The laser head 20 of the laser beam dicing device 10 is provided with a spectroscopic means 24 which divides a laser beam L oscillated from a laser oscillator 21 into a plurality of optical paths, a plurality of converging means 23 and 23 which individually converge the laser beams L1 and L2 divided into the plurality of optical paths so that the laser head 20 can cope with various processes, by simultaneously emitting the laser beams L1 and L2 to a plurality of spots by individually converging the beams L1 and L2. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
