| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a lead frame capable of easily and surely manufacturing the lead frame, on which a semiconductor chip is loaded and which has the excellent flatness of a die pad, and to provide the lead frame manufactured in this manner. <P>SOLUTION: An inclined plane is formed to a die pad support 24 by a depression working so that the die pad support 24 having a board thickness T (mm) before the working reaches a depression angleθ(°) as a declination from the horizontal direction to a lower section and a set stepped section D (mm) as a stepped section in the specified vertical direction reaches a set value in a die pad 23, while the quantity W<SB>E</SB>(mm) of a thickness dispersion is set so as to satisfy D<SB>D</SB>≤¾√[äD T/(Tcosθ-W<SB>E</SB>) tanθ}<SP>2</SP>-(D/tanθ)<SP>2</SP>]-D¾ to the set quantity D<SB>D</SB>(mm) of the stepped section, thus manufacturing the lead frame. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
