发明名称 SUBSTRATE HOLDER, ION BEAM MILLING DEVICE, AND METHOD FOR HOLDING SUBSTRATE IN VACUUM PROCESS DEVICE
摘要 PROBLEM TO BE SOLVED: To provide the substrate holder of a vacuum process device for processing a substrate to hold the substrate so that a gap between the substrate and the substrate holder can be within a predetermined range, and to prevent the deterioration of gas cooling effects to the substrate. SOLUTION: This substrate holder 100 is configured of a substrate mounting part 5 whose substrate mounting face on which a substrate 4 is mounted is configured so as to be bent like recess, a substrate holding stand 1 having a gas passage 9 for supplying gas between the mounted substrate and the substrate mounting face and a substrate fixing part 101 for fixing the substrate 4 mounted on the substrate mounting part 5. Then, a gap 8 filled with gas supplied from the gas passage 9 is formed between the substrate 4 and the substrate mounting part 5. Furthermore, the substrate fixing part 100 is configured to add a compressing force to a direction perpendicular to the board pressure of the substrate 4 for holding the substrate 4 so that the substrate 4 can be bent like recess along the substrate mounting part 5, and that the gap 8 can be formed with a predetermined interval. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005109330(A) 申请公布日期 2005.04.21
申请号 JP20030343202 申请日期 2003.10.01
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 OKAWA HIROO
分类号 H01L21/683;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/683
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