METHOD FOR SEPARATING WAFER FORMING LAMINATED STRUCTURE BY BONDING

摘要

PROBLEM TO BE SOLVED: To separate a target lamination structure to be separated into two members by a force of appropriate strength. SOLUTION: The method is for separating at least two wafers (1, 2) forming a laminated structure by being bonded to each other, in which at least a bending force is applied to the whole or part of the lamination structure, thereby separating the lamination structure into two members along a desired separation plane. The present invention can be applied, in particular, to a method of forming a thin semiconductor layer. COPYRIGHT: (C)2005,JPO&NCIPI