| 摘要 |
PROBLEM TO BE SOLVED: To excellently coat the side surface of a semiconductor-chip assembly with a proper quantity of a protective resin. SOLUTION: A plurality of the assemblies (3) with leads (5) having headers (11) and leads (12) and semiconductor elements (10) fixed among the headers (11) are held by a supporter (4). The protective resin (6) under a fluid state adhering on the top faces (1a) of a dipping-up member (1) is attached on the side faces (10a) of the semiconductor elements (10) of the semiconductor-chip assemblies (3), by the dipping-up member (1) moved from places of a dipping dipped in the protective resin (6) under the fluid state to the places of a coating. Thereafter, the side surfaces (10a) of the elements (10), to which the resin (6) adheres, are coated with a resin sealing body (17). An excess quantity of the protective resin (6) is dropped from the dipping-up member (1), and the proper quantity of the protective resin (6) under the fluid stat is attached on the dipping-up member (1) moved to the places of the coating in a proper thickness by its own viscosity. COPYRIGHT: (C)2005,JPO&NCIPI
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