| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for electronic component where reliability of loading bonding of a package of electronic component and a substrate is improved, processing is easy and cost is low. SOLUTION: In the package for electronic component, provided with the base 1 of a flat surface rectangular form holding electronic component elements and a cap 2 for hermetically sealing the electronic component elements, a pair of terminal electrodes 12, 13, is formed along counter side of a footprint of the base. A pair of the terminal electrodes is constituted of a region where electrodes counter with each other and are formed, and a region where one terminal electrode is not formed without countering mutually. A pair of the electrode terminals of the base is jointed to the substrate by a conductive bonding material. COPYRIGHT: (C)2005,JPO&NCIPI
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