发明名称 Joining material stencil and method of use
摘要 A stencil for the deposition of a heat yieldable joining material includes at least one pattern formation member and at least one channel formation portion associated with the pattern formation member.
申请公布号 US2005085007(A1) 申请公布日期 2005.04.21
申请号 US20030690177 申请日期 2003.10.20
申请人 VU CHUONG;WARNES LIDIA 发明人 VU CHUONG;WARNES LIDIA
分类号 B23K3/08;H01L21/44;H05K1/02;H05K3/00;H05K3/12;H05K3/34;(IPC1-7):H01L21/44 主分类号 B23K3/08
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