发明名称 Extracting semiconductor device model parameters
摘要 The present invention includes a method for extracting semiconductor device model parameters for a device model such as the BSIM4 model. The device model parameters for the device model includes a plurality of base parameters, DC model parameters, temperature dependent related parameters, and AC parameters. The method also includes steps for extracting various DC model parameters. The present invention also includes a method for extracting device model parameters including the steps of extracting a portion of the DC model parameters based on the terminal current data, modifying the terminal current data based on the extracted portion of the DC model parameters, and extracting a second portion of the DC model parameters based on the modified terminal current data.
申请公布号 US2005086033(A1) 申请公布日期 2005.04.21
申请号 US20030653562 申请日期 2003.09.02
申请人 CADENCE DESIGN SYSTEMS, INC. 发明人 CHEN PING;XIE JUSHAN
分类号 G01R27/28;G01R31/28;G06F17/10;G06F19/00;(IPC1-7):G06F17/10 主分类号 G01R27/28
代理机构 代理人
主权项
地址